EFFECT OF CONTROLLED POROSITY ON THE MECHANICAL PROPERTIES OF Ti-Zr-Sn-Mo BIOMEDICAL ALLOYS , ARCHIVES OF METALLURGY AND MATERIALS
, 제65권(집)
, 제4호
, PP.1341~1344
, 2020.07.24
Mechanism for mitigating filler-induced reliability degradation in semiconductor devices assembled utilizing an LOC package technique, Journal of Mechanical Science and Technology
, 제34권(집)
, 제2호
, PP.675~680
, 2020.02.04
Cleavage Dicing Mechanics in Silicon Wafers, Korean Journal of Metals and Materials
, 제57권(집)
, 제11호
, PP.689~694
, 2019.11.05
Effect of Sub-Micro or Nano-Scale Defects Resulting from Various Wafer Finishing Processes on Degradation of Individually Diced Devices, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY
, 제17권(집)
, 제11호
, PP.7830~7834
, 2017.08.14
Adoption of Hybrid Dicing Technique to Minimize Sawing-Induced Damage during Semiconductor Wafer Separation, MATERIALS TRANSACTIONS
, 제58권(집)
, 제4호
, PP.530~534
, 2017.02.01
Effect of grain size evolution in an Au-wire ball on debonding failure with the Al-pad in semiconductor devices, THIN SOLID FILMS
, 제641호
, PP.69~72
, 2017.01.23
Effect of Sawing Velocity Variation on Chipping Damage of Semiconductor Wafers with Different Thickness, Korean Journal of Metals and Materials
, 제54권(집)
, 제8호
, 2016.08.15
Dependence of Chipping Damage on the Crystallographic Orientation during the Mechanical Dicing of Silicon Wafers, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY
, 제16권(집)
, 제10호
, PP.11113~11118
, 2016.08.01
Effect of polishing process of a semiconductor wafer on the fracture mechanics of diced chips , Korean Journal of Metals and Materials
, 제54권(집)
, 제3호
, PP.204~209
, 2016.03.02
Effect of sawing velocity variation on the mechanical dicing-induced damage in semiconductor silicon wafer, Korean Journal of Metals and Materials
, 제53권(집)
, 제5호
, PP.306~311
, 2015.05.01
Advanced lead-on-chip tape design to improve thermal-cycling reliability in semiconductor devices, Science of Advanced Materials
, 제6권(집)
, PP.1~4
, 2014.09.30
Fracture Strength Improvement of Semiconductor Devices Encapsulated Using a Lead-on-Chip Packaging Technique, KOREAN JOURNAL OF METALS AND MATERIALS
, 제51권(집)
, 제6호
, PP.441~447
, 2013.06.28
Fracture Strength Measurement of Single Crystal Silicon Chips as a Function of Loading Rate during 3-Point Bending Test, KOREAN JOURNAL OF METALS AND MATERIALS
, 제50권(집)
, 제2호
, PP.146~151
, 2012.02.01
웨이퍼 그라인딩 공정으로 생성된 스크래치 마트를 갖는 실리콘 칩들에서의 벽개 파괴현상, Korean Journal of Metals and Materials
, 제49권(집)
, 제9호
, PP.726~731
, 2011.09.30
Adoption of single-sided adhesive tape to improve thermal-cycling reliability in plastically-encapsulated semiconductor devices, Current Applied Physics
, 제11권(집)
, PP.396~399
, 2011.03.21
In Situ Examinations of Mechanical Dicing-Induced Damage in Semiconductor Wafers, Surface Review & Letters
, 제17권(집)
, 제3호
, PP.317~321
, 2010.06.15
Effect of Grinding-Induced Scratch Geometry on Fracture Strengthof Plastic-Encapsulated Semiconductor Devices, Surface Review and Letters
, 제17권(집)
, 제3호
, PP.323~327
, 2010.06.15
실리콘 웨이퍼에 2종 다이싱 공정의 도입이 반도체 디바이스의 T.C. 신뢰성에 미치는 영향, 마이크로전자 및 패키징학회지
, 제16권(집)
, 제4호
, PP.1~4
, 2009.12.01
리드 온 칩 패키징 기술을 이용하여 조립된 반도체 제품에서 패시베이션 박막의 TC 신뢰성에 영향을 미치는 요인들, 한국재료학회지
, 제19권(집)
, 제5호
, PP.288~292
, 2009.05.31
리드 온 칩 패키징 기술을 이용하여 조립된 반도체 제품에서 패시베이션 파손을 막기위한 본딩패드의 합리적 설계, Journal of the Microelectronics & Packaging Society
, 제15권(집)
, 제2호
, PP.69~73
, 2008.12.30
프라스틱 패키징 전과 후 실리콘 칩들의 휨 파괴 유형에 대한 변화, Journal of the Microelectronics & Packaging Society
, 제15권(집)
, 제1호
, PP.65~69
, 2008.12.30
Application of Paris's Law to Thermal Cycling-Induced Failure in Semiconductor Device Patterns, Metals and Materials International
, 제14권(집)
, 제6호
, PP.799~802
, 2008.12.18
Microstructural characterization of droplet emulsified Mg60Cu30Y10 powder, Materials Science and Engineering A
, 제449권(집)
, PP.727~732
, 2007.12.31
Dependence of thermal-Cycling-Induced Deformation on Passivation Morphology in Plastic-Encapsulated Microelectronic Devices, Solid State Phenomena
, 제124권(집)
, PP.1~4
, 2007.12.31
Prevention of Dicing-Induced Damage in Semiconductor Wafers, Key Engineering Materials
, 제345권(집)
, PP.485~488
, 2007.12.31
The Dependence of Thermal-Cycling-Induced Failure Mechanism on Topological Feature of Passivated Metallic Conductors in Plastic-Encapsulated Microelectronic Devices, Japanese Journal of Applied Physics
, 제45권(집)
, 제10호
, PP.7677~7679
, 2006.12.31
Filler-Induced Failure Mechanism in Plastic-Encapsulated Microelectronic Packages, Matals and Materials Intenational
, 제12권(집)
, 제6호
, PP.513~516
, 2006.12.31
실리콘 칩을 포함하는 리드-온-칩 패키지의 파괴강도에 관한 연구, 대한금속재료학회지
, 제44권(집)
, 제3호
, PP.181~185
, 2006.03.31