Thermal-Cycling-Induced Si3N4 Damage in Semiconductor Devices Assembled Utilizing a Lead-on-Chip Package, Korean Journal of Metals and Materials , 제61권(집) , 제2호 , PP.76~83 , 2023.02.01

Morphological characterization of 325 mesh-grinding-induced defects on silicon wafer surface , MICROELECTRONICS RELIABILITY , 제139권(집) , PP.1~5 , 2022.12.01

Prevention of Tape-Induced Si3N4 Damage in Semiconductor Silicon Devices Encapsulated Utilizing Lead-on-Chip Packaging Technique, MATERIALS TRANSACTIONS , 제62권(집) , 제1호 , PP.105~110 , 2021.01.01

Martensitic Transformation Behaviors of Compositionally Graded Ti-Ni-Based Shape Memory Alloys, Science of Advanced Materials , 제12권(집) , 제10호 , PP.1586~1590 , 2020.10.30

EFFECT OF CONTROLLED POROSITY ON THE MECHANICAL PROPERTIES OF Ti-Zr-Sn-Mo BIOMEDICAL ALLOYS , ARCHIVES OF METALLURGY AND MATERIALS , 제65권(집) , 제4호 , PP.1341~1344 , 2020.07.24

Mechanism for mitigating filler-induced reliability degradation in semiconductor devices assembled utilizing an LOC package technique, Journal of Mechanical Science and Technology , 제34권(집) , 제2호 , PP.675~680 , 2020.02.04

Cleavage Dicing Mechanics in Silicon Wafers, Korean Journal of Metals and Materials , 제57권(집) , 제11호 , PP.689~694 , 2019.11.05

Effect of Sub-Micro or Nano-Scale Defects Resulting from Various Wafer Finishing Processes on Degradation of Individually Diced Devices, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY , 제17권(집) , 제11호 , PP.7830~7834 , 2017.08.14

Adoption of Hybrid Dicing Technique to Minimize Sawing-Induced Damage during Semiconductor Wafer Separation, MATERIALS TRANSACTIONS , 제58권(집) , 제4호 , PP.530~534 , 2017.02.01

Effect of grain size evolution in an Au-wire ball on debonding failure with the Al-pad in semiconductor devices, THIN SOLID FILMS , 제641호 , PP.69~72 , 2017.01.23

Effect of Sawing Velocity Variation on Chipping Damage of Semiconductor Wafers with Different Thickness, Korean Journal of Metals and Materials , 제54권(집) , 제8호 , 2016.08.15

Dependence of Chipping Damage on the Crystallographic Orientation during the Mechanical Dicing of Silicon Wafers, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY , 제16권(집) , 제10호 , PP.11113~11118 , 2016.08.01

Effect of polishing process of a semiconductor wafer on the fracture mechanics of diced chips , Korean Journal of Metals and Materials , 제54권(집) , 제3호 , PP.204~209 , 2016.03.02

Effect of sawing velocity variation on the mechanical dicing-induced damage in semiconductor silicon wafer, Korean Journal of Metals and Materials , 제53권(집) , 제5호 , PP.306~311 , 2015.05.01

Advanced lead-on-chip tape design to improve thermal-cycling reliability in semiconductor devices, Science of Advanced Materials , 제6권(집) , PP.1~4 , 2014.09.30

Fracture Strength Improvement of Semiconductor Devices Encapsulated Using a Lead-on-Chip Packaging Technique, KOREAN JOURNAL OF METALS AND MATERIALS , 제51권(집) , 제6호 , PP.441~447 , 2013.06.28

Fracture Strength Measurement of Single Crystal Silicon Chips as a Function of Loading Rate during 3-Point Bending Test, KOREAN JOURNAL OF METALS AND MATERIALS , 제50권(집) , 제2호 , PP.146~151 , 2012.02.01

웨이퍼 그라인딩 공정으로 생성된 스크래치 마트를 갖는 실리콘 칩들에서의 벽개 파괴현상, Korean Journal of Metals and Materials , 제49권(집) , 제9호 , PP.726~731 , 2011.09.30

Adoption of single-sided adhesive tape to improve thermal-cycling reliability in plastically-encapsulated semiconductor devices, Current Applied Physics , 제11권(집) , PP.396~399 , 2011.03.21

Effect of Grinding-Induced Scratch Geometry on Fracture Strengthof Plastic-Encapsulated Semiconductor Devices, Surface Review and Letters , 제17권(집) , 제3호 , PP.323~327 , 2010.06.15

In Situ Examinations of Mechanical Dicing-Induced Damage in Semiconductor Wafers, Surface Review & Letters , 제17권(집) , 제3호 , PP.317~321 , 2010.06.15

실리콘 웨이퍼에 2종 다이싱 공정의 도입이 반도체 디바이스의 T.C. 신뢰성에 미치는 영향, 마이크로전자 및 패키징학회지 , 제16권(집) , 제4호 , PP.1~4 , 2009.12.01

리드 온 칩 패키징 기술을 이용하여 조립된 반도체 제품에서 패시베이션 박막의 TC 신뢰성에 영향을 미치는 요인들, 한국재료학회지 , 제19권(집) , 제5호 , PP.288~292 , 2009.05.31

리드 온 칩 패키징 기술을 이용하여 조립된 반도체 제품에서 패시베이션 파손을 막기위한 본딩패드의 합리적 설계, Journal of the Microelectronics & Packaging Society , 제15권(집) , 제2호 , PP.69~73 , 2008.12.30

프라스틱 패키징 전과 후 실리콘 칩들의 휨 파괴 유형에 대한 변화, Journal of the Microelectronics & Packaging Society , 제15권(집) , 제1호 , PP.65~69 , 2008.12.30

Application of Paris's Law to Thermal Cycling-Induced Failure in Semiconductor Device Patterns, Metals and Materials International , 제14권(집) , 제6호 , PP.799~802 , 2008.12.18

Prevention of Dicing-Induced Damage in Semiconductor Wafers, Key Engineering Materials , 제345권(집) , PP.485~488 , 2007.12.31

Dependence of thermal-Cycling-Induced Deformation on Passivation Morphology in Plastic-Encapsulated Microelectronic Devices, Solid State Phenomena , 제124권(집) , PP.1~4 , 2007.12.31

Microstructural characterization of droplet emulsified Mg60Cu30Y10 powder, Materials Science and Engineering A , 제449권(집) , PP.727~732 , 2007.12.31

온도변화가 프라스틱 패키지의 파괴강도에 미치는 영향, 대한금속.재료학회지 , 제45권(집) , 제7호 , PP.429~433 , 2007.04.28

The Dependence of Thermal-Cycling-Induced Failure Mechanism on Topological Feature of Passivated Metallic Conductors in Plastic-Encapsulated Microelectronic Devices, Japanese Journal of Applied Physics , 제45권(집) , 제10호 , PP.7677~7679 , 2006.12.31

Filler-Induced Failure Mechanism in Plastic-Encapsulated Microelectronic Packages, Matals and Materials Intenational , 제12권(집) , 제6호 , PP.513~516 , 2006.12.31

실리콘 칩을 포함하는 리드-온-칩 패키지의 파괴강도에 관한 연구, 대한금속재료학회지 , 제44권(집) , 제3호 , PP.181~185 , 2006.03.31